| 摘要 |
PROBLEM TO BE SOLVED: To provide a photocurable or thermosetting resin composition suitable for an interlaminar insulation resin of a printed wiring board, a solder resist developable by an aqueous alkali solution, or the like, having high flame retardancy, and excellent bleeding out resistance, flexibility, adhesion, folding resistance, flexibility, heat resistance at the use of solder, moisture resistance and insulating properties. SOLUTION: The photocurable or thermosetting resin composition contains (A) a carboxy-modified epoxy (meth)acrylate resin, (B) a phosphorus-containing epoxy resin represented by formula (1), (C) a photopolymerization initiator, (D) a diluent, (E) a curing agent, (F) a phosphorus-containing flame retardant having a specific structure and (G) aluminum hydroxide as essential components, regulated so that the content of phosphorus in the component (B) may be 1-2 mass%, the content of phosphorus in the component (F) may be 2.5-4.5 mass% each based on the total of the components (A) to (E), and the content of the component (G) based on 100 pts.mass of the total of the components (A) to (E) may be 40-60 pts.mass. COPYRIGHT: (C)2007,JPO&INPIT
|
