发明名称 LAMINATED TYPE SEMICONDUCTOR DEVICE AND CHIP SELECTION CIRCUIT
摘要 <P>PROBLEM TO BE SOLVED: To provide a laminated type semiconductor device which can select a desired semiconductor chip with a unique chip identification number with a simple configuration by using a semiconductor chip having the same structure. <P>SOLUTION: This laminated type semiconductor device is equipped with arithmetic circuits 12 for carrying out increment calculation with respect to input values A0, A1, A2 accompanying each of laminated five DRAM chips to produce arithmetic outputs S0,S1, S2 which are different from the input values; and comparison circuits 13 for comparing a chip selection address CA connected to the DRAM chips in common and an own chip identification number CN to output a chip selection signal Sc when a coincidence is detected in the comparison, and a connection path is formed so that cascade connection is carried out for a plurality of increment circuits 12 according to the laminating sequence and arithmetic outputs S0, S1, S2 of a preceding stage become the input values A0, A1, A2 of a post stage, then the plurality of chip identification numbers CN are individually assigned to each DRAM chip. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007157266(A) 申请公布日期 2007.06.21
申请号 JP20050352692 申请日期 2005.12.06
申请人 ELPIDA MEMORY INC;HITACHI ULSI SYSTEMS CO LTD 发明人 IKEDA HIROAKI;SHIBATA KAYOKO;YAMADA JUNJI;INOUE YOSHIHIKO;MIWA HITOSHI;IJIMA TATSUYA
分类号 G11C5/00;G06F12/06;H01L21/8242;H01L27/108 主分类号 G11C5/00
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