| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device which suppresses the occurrence of surface chip and the semiconductor device formed by this method. <P>SOLUTION: The semiconductor manufacturing method comprises a process wherein a plurality of semiconductor elements (semiconductor chips) are arranged in a mold with a distance between each other so as to have the shape of lattice to effect resin sealing, and to form an integrated resin sealing body 10', in which the plurality of semiconductor chips are sealed; a process for effecting half cuts 16 in transversal and lateral directions on a main surface provided with an indication mark 13 of the integrated resin sealing body 10', in which the plurality of semiconductor chips are sealed; and a process for effecting full cut by a dicing blade 15 from a rear surface provided with external electrodes 11, 12 along the half cut groove type lines 16, to divide and form a plurality of pieces of resin sealing bodies 10' individually, in which the single body of semiconductor chip is sealed. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
