| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a dielectric laminate structure which can manufacture a dielectric laminate structure having improved reliability, to provide the dielectric laminate structure having improved reliability, and to provide a wiring board equipped with this dielectric laminate structure. <P>SOLUTION: A capacitor 1 is manufactured by baking a laminate 13 provided with a metal foil 2; a dielectric layer 11 formed on the main surfaces 2b, 2c of the metal foil 2 and having a cylindrical through hole 11a; and a conductor layer 12 formed on the dielectric layer 11, communicating with the through hole 11a, and having a circular through-hole 12a having a diameter larger than that of the through-hole 11a. The through-holes 11a, 12a are formed in such a way that the conductor layer 12 is formed on the dielectric layer 11, and then, the dielectric layer 11 and the conductor layer 12 are collectively drilled with laser. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
