| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and method for manufacturing a laminated solid semiconductor device with a good yield. SOLUTION: The size and formation position of each semiconductor device are adjusted considering a wafer deformation caused by heating treatment in an electrode joining step, the individual semiconductor devices are arranged on wafers, the wafer deformation when the semiconductor devices are formed in an alignment step necessary for lamination is calculated, the calculated deformation is corrected upon join, and then the wafers are joined. COPYRIGHT: (C)2007,JPO&INPIT
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