| 摘要 |
PROBLEM TO BE SOLVED: To provide a failure analyzer for efficiently performing layer analysis using an absorption electric potential method on a semiconductor integrated circuit device. SOLUTION: In this failure analyzer 10, an end-point search part 2 searches for a wiring route end point on a pattern data of an observing object electrical conducting layer based on input information on the conducting layer. An expectation image production part 3 determines light and shade or contrast of the pattern data according to a layer at the end point to produce a potential contrast expectation image. A comparison part 5 compares the expectation image stored in an expectation image storage part 4 with a potential contrast observation image stored in an observation image storage part 1. A comparison result image production part 6 converts conformity/inconformity information output from the comparison part 5 into a comparison result image. A display part 7 displays the result image. COPYRIGHT: (C)2007,JPO&INPIT
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