<p>A coating apparatus is provided with a substrate holding section for horizontally holding a substrate; a chemical nozzle for supplying the center portion of the substrate horizontally held by the substrate holding section with a chemical; a rotating mechanism for rotating the substrate holding section for applying the chemical by spreading it on the surface of the substrate by centrifugal force; an airflow forming means for forming a down flow of an ambient gas on the surface of the substrate horizontally held by the substrate holding section; an exhaust means for exhausting the ambient atmosphere of the substrate; a gas nozzle for supplying the surface of the substrate with a laminar flow forming gas having a dynamic viscosity higher than that of the ambient gas. The coating apparatus is characterized in that the center portion of the substrate is supplied with the ambient gas or the laminar flow forming gas.</p>
申请公布号
WO2007069728(A1)
申请公布日期
2007.06.21
申请号
WO2006JP325060
申请日期
2006.12.15
申请人
TOKYO ELECTRON LIMITED;SAWADA, IKUO;MATSUZAKI, KAZUYOSHI;TANAKA, TAKASHI;IWASHITA, MITSUAKI;MUNAKATA, MIZUE