发明名称 |
HEAT SINK PACKAGING ASSEMBLY FOR ELECTRONIC COMPONENTS |
摘要 |
A packaging assembly (100) includes a plurality of dissimilar die (102, 104, 106) bonded to a base board (110) and ground coupled to a heat sink (108) through an opening (132). A mating board (112) is coupled to the base board (110) to provide separate surface mountable contacts (148-158, 166) with which to independently bias each die (102, 104, 106) while the heat sink (108) provides thermal dissipation for the die. Assembly (100) provides a surface mountable package well suited to multiband applications. |
申请公布号 |
WO2007024355(A3) |
申请公布日期 |
2007.06.21 |
申请号 |
WO2006US27102 |
申请日期 |
2006.07.13 |
申请人 |
MOTOROLA, INC.;DIAZ, JOSE;ANDERSON, GEORGE, C. |
发明人 |
DIAZ, JOSE;ANDERSON, GEORGE, C. |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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