| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a pattern deposition method which can solve a problem with an insufficient area in which an undividable pattern can be disposed. <P>SOLUTION: The method comprises a first step of disposing patterns designed each to have an element area of a predetermined width at a predetermined disposition pitch with the patterns spaced by a predetermined width of scribe line area, and a second step of disposing an undividable pattern in the scribe line area on a mask. The first step includes a step of setting a device chip deposition pitch at a value corresponding to a positive integral multiple of one side of a subfield; and disposing the patterns so that a predetermined width of blank area is provided in a subfield adjacent to the subfield having the scribe line area and corresponding to an edge of the element area to be parallel with the scribe line area, and so that a boundary between the blank area and the scribe line area coincides with a boundary between the subfields. The second step includes a step of disposing the undividable pattern within the subfield including the scribe line area. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
