发明名称 |
HIGHLY BENDABLE AND FLEXIBLE METAL-CLAD LAMINATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a flexible metal-clad laminate with a high flexibility and superior in general purpose availability not limiting a material used therein and also to provide a flexible circuit board. SOLUTION: The flexible metal-clad laminate including an insulating layer and a conductive layer is characterized in that the flexible metal-clad laminate has a ratio W1/W2 being a ratio of the thickness of the insulating layer W1 described above and the thickness of the conductive layer W2 described above of≥0.70 and≤1.30. COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007152835(A) |
申请公布日期 |
2007.06.21 |
申请号 |
JP20050353570 |
申请日期 |
2005.12.07 |
申请人 |
KANEKA CORP |
发明人 |
ONO KAZUHIRO;KANESHIRO NAGAYASU |
分类号 |
B32B15/08;B32B15/088;H05K1/03 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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