发明名称 HIGHLY BENDABLE AND FLEXIBLE METAL-CLAD LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a flexible metal-clad laminate with a high flexibility and superior in general purpose availability not limiting a material used therein and also to provide a flexible circuit board. SOLUTION: The flexible metal-clad laminate including an insulating layer and a conductive layer is characterized in that the flexible metal-clad laminate has a ratio W1/W2 being a ratio of the thickness of the insulating layer W1 described above and the thickness of the conductive layer W2 described above of≥0.70 and≤1.30. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007152835(A) 申请公布日期 2007.06.21
申请号 JP20050353570 申请日期 2005.12.07
申请人 KANEKA CORP 发明人 ONO KAZUHIRO;KANESHIRO NAGAYASU
分类号 B32B15/08;B32B15/088;H05K1/03 主分类号 B32B15/08
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