发明名称 THICKNESS MEASURING METHOD AND THICKNESS MEASURING APPARATUS OF LAMINATED THIN FILM
摘要 PROBLEM TO BE SOLVED: To provide a thickness measuring method and a thickness measuring apparatus of a laminated thin film for accurately, instantaneously and noncontactly measuring a small thickness of the laminated thin film such as a functional resin film and an information electronic material. SOLUTION: In the thickness measuring method of the laminated thin film, a sample (7) having the laminated thin film is irradiated with a white light, a reflection light or a transmission light obtained from the sample (7) is spectrally separated, only an interference signal is selected by implementing a wavelet process after the obtained spectrum is converted into a frequency signal, and the thickness of the thin film is detected by implementing a frequency analyzing process after the interference signal is decimated. The thickness measuring apparatus comprises a light source (1), an irradiating optical fiber (2), a light receiving optical fiber (3), a spectroscope (4), a multichannel detector (5) and a calculating/processing means (6) for implementing the above-described processes. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007155630(A) 申请公布日期 2007.06.21
申请号 JP20050354267 申请日期 2005.12.08
申请人 MITSUBISHI CHEMICAL ENGINEERING CORP 发明人 KUDO SHIGEKI;SAKAI HIDEAKI
分类号 G01B11/06 主分类号 G01B11/06
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