LEAD FRAME CONNECTOR AND ELECTRONIC PACKAGES CONTAINING SAME

摘要

This invention relates to a lead frame connector utilizing mechanical clamping features to hold the lead frame in place on a dielectric substrate. The lead frame is held onto the substrate by its clamping mechanism while a bonding operation is performed. After the bonding operation has been performed, the clamping features of the lead frame assist in keeping it rigid and in increasing the strength of the bonded joint. The lead frame can be attached to various electronic devices, such as semiconductor packages, hybrid circuits, and passive elements.