MULTILAYER PRINTED WIRING PLATE, AND METHOD FOR FABRICATING THE SAME

摘要

Provided is a multilayer printed wiring plate, in which an insulating resin film and conductor circuits are formed over another insulating resin layer housing a semiconductor element and in which the conductor circuits are electrically connected with each other through a via hole, wherein an electromagnetic shield layer is formed either in the insulating resin layer enclosing a recess for housing the semiconductor element or in the inner wall face of the recess, and wherein the semiconductor element is mounted in the recess.