COPPER FOIL ATTACHED TO THE CARRIER AND PRINTED CIRCUIT BOARD USING THE SAME

摘要

A copper foil attached to a carrier and a printed circuit board using the same are provided to make a carrier foil and a copper foil peeled off easily even in the circumference of a high temperature. The copper foil attached to a carrier includes a carrier foil, a release layer and a copper foil. The release layer consists of two layers of a metal (A) having detachability and a metal (B) for making plating of a copper foil easy. The content (c) of the metal (A) and the content (d) of the metal (B) that constitute the release foil of the carrier foil and the content (e) of the metal (A) and the content (f) of the metal (B) that constitute the release layer of the copper foil satisfies the formula of c/(c+d)-e/(e+f)x100>=3(%).