| 摘要 |
FIELD: radio engineering; microwave engineering for radars, radio communications, and measurement technology. ^ SUBSTANCE: proposed microstrip attenuator has board in the form of insulating plate with electricity-conductive screen, input and output microstrip lines of electricity-conductive material, and resistive absorbing layer with electricity-conductive components connected in parallel with the latter. Absorbing layer is electrically connected between input and output microstrip lines. Attenuator also has additional electricity-conductive screen. Disposed in a spaced relation to each other above board in the form of plate are N additional insulating plates, where N is natural numerical series, their coefficient of heat conductivity being higher than that of board material. N - 1 additional resistive absorbing layers are disposed between N additional plates, additional electricity-conductive components being connected in parallel with them. All absorbing layers and their parallel-connected components are disposed in plate clearances, these components being interruptive structures abutting against lateral edges of resistive absorbing layers. Components are made of electricity-conductive material whose melting point is lower than that of resistive material and of microstrip line electricity-conductive material. Additional electricity-conductive screen is deposited onto upper surface of Nth additional insulating plate and its thickness and heat conductivity are greater than those of the latter. Electricity-conductive screen and plate can be provided with hole under absorbing layer incorporating adjusting insert made of electricity-conductive material whose phase transformation occurs at temperature below melting point of resistive material and of microstrip-line electricity-conductive material. Plate clearances may be reducing in direction from input microstrip line to output one. Width of clearances between all plates and thickness of all plates may be reducing in direction from Nth plate and plate width may be increasing in direction from board to Nth plate. Components can be made as interruptive structures in the form of stubs abutting against lateral edges of resistive absorbing layers, interruption intervals may be increasing from input microstrip line to output one. Width of resistive absorbing layers can be different and layer side edges need not be necessarily disposed one on top of other. ^ EFFECT: enhanced dissipation power and safety, facilitated maintenance of device, provision for adjusting its matching. ^ 6 cl, 4 dwg |
