| 摘要 |
A method for packaging a flash memory card is provided to protect a circuit from the stress due to the leak of moisture and a repeating use by using a protection layer made of glue. A first soldering process of passive elements is performed on a surface of a PCB(301). A dicing process is performed on a wafer to obtain a plurality of dies(302). The dies are mounted on the PCB(303). A second soldering process of the dies are performed on the PCB(304). A substrate is formed at a periphery and a lower portion of the PCB by using a molding process(305). A cutting process is performed on the substrate(306). A protection layer is formed on the resultant structure including the passive elements and the dies(307). An insert molding process is performed on the resultant structure to form the substrate like a monolithic structure(308). The protection layer is made of glue.
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