| 摘要 |
FIELD: semiconductor instrumentation engineering; photodetector device manufacture; assembling photodetector components using polymeric sealing adhesive. ^ SUBSTANCE: proposed method for assembling photodetector device components makes use of universal polymeric material incorporating universal properties of optical and structural adhesive, sealing and encapsulating compounds based on polyorganosiloxane urethanes, and is characterized in fast curing taking maximum 1.5 h at desired adhesive strength, optical transparence, flexibility, minimal toxicity, and ability of its use in all main adhesive operations in assembling photodetector devices due to introduction of silicone triole and adduct of silicone oligodiol and curing catalyst toluylene diisocyanate in the amount of 0.09 - 0.12 % relative to silicone triole. ^ EFFECT: improved quality of polymeric material used for assembling photodetector device and reduced time taken for this operation. ^ 1 cl, 1 tbl |
