APPARATUS HAVING A PROBE CARD INCLUDING A HEAT SHIELD

摘要

A semiconductor test apparatus including a probe card with a heat shielding member is provided to effectively prevent the heat generated from a wafer from being conducted to a printed circuit board. Various circuits are formed on a printed circuit board(200), and a needle(210) is connected to the printed circuit board. The needle comes in contact with an input/output pad of a wafer(W) with a semiconductor device formed thereon. The needle is fixed to the printed circuit board by a fixing part(220). A heat shielding member(250) is interposed between the printed circuit board and the fixing portion. A probe card(20) is electrically connected to the needle, and has a pogo pad(230) transmitting and receiving a signal from a tester(240).