PLASTIC CONDUCTIVE PARTICLES

摘要

Provided are plastic particles, which comprise core beads containing nano-clay with excellent thermal properties and high compression elasticity, and are useful for IC packaging or LCD packaging. The plastic conductive particles comprise: plastic core beads comprising polystyrene particles that contain nano-clay dispersed uniformly therein via suspension polymerization, have a 5% thermal decomposition temperature of 250-350 deg.C, where any glass transition point or melting point is not detected, and show a high compression elasticity of 400-550 kgf/mm^2; a nickel coating layer formed on the beads to a thickness of 0.1-10 micrometers; and a solder layer formed on the nickel coating layer to a thickness of 1-100 micrometers and comprising any one selected from the group consisting of Sn/Pb, Sn/Ag, Sn, Sn/Cu, Sn/Zn and Sn/Bi.