TEST SHOT MAPPING METHOD OF SEMICONDUCTOR WAFER

摘要

A test shot mapping method of a semiconductor wafer is provided to automatically generate a test shot map for various shot addresses and various shot shapes. Information on a probe card is obtained(10), and actual X and Y sizes and physical X and Y sizes are inputted(15,20). It is determined to carry out merge test and/or single test for a die positioned on a wafer. A physical address mapping is carried out based on the actual X and Y sizes. A scramble address mapping is carried output based on the physical X and Y sizes(35). A wafer amp is formed to set X and Y reference coordinates(45). X and Y sizes of shot are mapped from the X and Y reference coordinates(50), and a test shot address is mapped for the die on the wafer.