| 摘要 |
A semiconductor package and its manufacturing method are provided to improve the productivity by connecting electrically an edge pad of a chip with an inner lead in spite of the increase of size of the chip using a through hole of the inner lead. A semiconductor package includes a chip, a lead frame and a contactor. The chip(110) includes an edge pad(111). The lead frame(120) is formed on the chip. The lead frame is composed of an inner lead and an outer lead. The inner lead includes a through hole(121). The contactor(130) is used for connecting electrically the chip and the inner lead with each other through the through hole.
|
