| 摘要 |
An anti-EMI(Electromagnetic Interference) modular structure is provided to prevent the EMI through the shielding by including an insulation layer and a substrate with an conductive layer. An anti-EMI modular structure includes a substrate(20), at least one electronic component(30), an insulating layer(40), and a conductive layer. The electronic component(30) is arranged on the substrate(20). The insulating layer(40) is arranged to cover the electronic component(30). The conductive layer is attached to the substrate(20) and the insulating layer(40). The substrate(20) includes at least one ground hole and a metal film. The ground hole penetrates the metal film, and at least one ground hole is exposed from the insulating layer(40) to attach the conductive layer to the exposed ground hole and the metal film.
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