| 摘要 |
A semiconductor device manufacturing apparatus and a semiconductor device manufacturing method using the same are provided to enhance the uniformity of the supply of chemicals onto a substrate by using a nozzle with an oblique hole. A semiconductor device manufacturing apparatus includes a process chamber, a chuck, and a nozzle. The chuck is installed in the process chamber in order to load stably a substrate and rotate the substrate. The nozzle(400) includes an oblique hole(422,426) capable of spraying obliquely chemicals onto a bottom portion of the substrate. The angle of the oblique hole is in the range of 1 to 60 degree.
|
