发明名称 Laser beam machining apparatus
摘要 <p>Control is exercised such that an arc discharge from a GMA electrode (33) is performed after or simultaneously with start of oscillation of laser light (24) from a laser oscillator (21), and oscillation of the laser light (24) from the laser oscillator (21) is stopped after or simultaneously with termination of the arc discharge from the GMA electrode (33). A coaxial laser beam machining head (22) is configured such that the GMA electrode (33) is disposed in a space portion (24d) between a first divisional laser beam (24b) and a second divisional laser beam (24c), which have been formed by division by first (27) and second (28) reflecting mirrors, coaxially with the laser beams (24b,24c). Alternatively, the coaxial laser beam machining head (22) is configured such that the GMA electrode (33) is disposed in a space portion (24d), which has been formed in a body of laser light by withdrawing part of the laser light outwardly with the use of first and second reflecting mirrors (27,28), coaxially with the body of the laser light. </p>
申请公布号 EP1574279(A3) 申请公布日期 2007.06.20
申请号 EP20050011458 申请日期 2001.03.30
申请人 MITSUBISHI HEAVY INDUSTRIES, LTD. 发明人 AKABA, TAKASHI;NAGASHIMA, TADASHI;ISHIDE, TAKASHI;TSUBOTA, SYUHOU
分类号 B23K26/00;B23K26/067;B23K26/06;B23K26/08;B23K26/14;B23K26/20 主分类号 B23K26/00
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