SEMICONDUCTOR PACKAGE HAVING PARTIALLY PLATED EXTERNAL LEAD AND MANUFACTURING METHOD THEREOF

摘要

A semiconductor package and its manufacturing method are provided to enhance a mounting capability and to prevent the generation of whisker by using a partially plated outer lead. A semiconductor package includes a package body and a lead frame. The package body(120) includes at least one IC chip. The lead frame is composed of an inner lead and an outer lead. The inner lead is mechanically electrically connected with the IC chip in the package body. The outer lead is prolonged from the inner lead. The outer lead is located at an outer portion of the package body. The outer lead includes at least one bent portion. A plating layer(135) is formed on an end portion of the outer lead.