发明名称 Method of using an adhesive for temperature control during plasma processing
摘要 Provided is a plasma processing method and apparatus and a tray for plasma processing, which are able to improve temperature controllability of a substrate. If a vacuum chamber is evacuated by a pump while introducing a specified gas by a gas supply unit into the vacuum chamber and a high-frequency power is applied by a coil use high-frequency power supply to a coil while maintaining an interior of the vacuum chamber at a specified pressure, then plasma is generated in the vacuum chamber, and a substrate placed on a substrate electrode can be subjected to plasma processing. At this time, by providing an adhesive sheet between the substrate electrode and the substrate, temperature controllability of the substrate can be improved.
申请公布号 US7232591(B2) 申请公布日期 2007.06.19
申请号 US20030408261 申请日期 2003.04.08
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 OKUMURA TOMOHIRO;NITTA TOSHINARI
分类号 H05H1/24;C03C17/23;C03C19/00;C23C16/00;H01L21/00;H01L21/306;H01L21/687 主分类号 H05H1/24
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