发明名称 APPARATUS FOR LOADING WAFER AT THE IMPLANTER
摘要 A wafer loading apparatus of an ion implanter is provided to improve the yield by preventing particles from being generated on a rear surface of a wafer using a pad with a planarized plane capable of maximizing a contact area between the pad and the rear surface of the wafer. A wafer loading apparatus of an ion implanter includes a robot arm for transferring a wafer(10) from a wafer cassette to an aiming position, a platen for rotating the wafers transferred by the robot arm, a wafer loading unit, and a pad. The wafer loading unit is used for loading stably a rear surface of the wafer at an edge portion of the platen. The pad(50) is installed on the wafer loading unit. The pad includes a planarized plane capable of preventing the generation of voids between the rear surface of the wafer and the wafer loading unit.
申请公布号 KR20070063133(A) 申请公布日期 2007.06.19
申请号 KR20050123082 申请日期 2005.12.14
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHAE, SEUNG WON;KIM, EUM SEOK;PARK, HEUNG WOO
分类号 H01L21/68 主分类号 H01L21/68
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