发明名称 |
APPARATUS FOR LOADING WAFER AT THE IMPLANTER |
摘要 |
A wafer loading apparatus of an ion implanter is provided to improve the yield by preventing particles from being generated on a rear surface of a wafer using a pad with a planarized plane capable of maximizing a contact area between the pad and the rear surface of the wafer. A wafer loading apparatus of an ion implanter includes a robot arm for transferring a wafer(10) from a wafer cassette to an aiming position, a platen for rotating the wafers transferred by the robot arm, a wafer loading unit, and a pad. The wafer loading unit is used for loading stably a rear surface of the wafer at an edge portion of the platen. The pad(50) is installed on the wafer loading unit. The pad includes a planarized plane capable of preventing the generation of voids between the rear surface of the wafer and the wafer loading unit.
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申请公布号 |
KR20070063133(A) |
申请公布日期 |
2007.06.19 |
申请号 |
KR20050123082 |
申请日期 |
2005.12.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHAE, SEUNG WON;KIM, EUM SEOK;PARK, HEUNG WOO |
分类号 |
H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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