发明名称 |
Filling small dimension vias using supercritical carbon dioxide |
摘要 |
Suitable particles may be deposited within an extremely small high-aspect ratio via by flowing the particles in a suspension using supercritical carbon dioxide. The particles may be made up of diblock copolymers or silesquioxane-based materials or oligomers of phobic homopolymers or pre-formed silica-based particles stabilized using diblock copolymers and may include chemical initiators to permit in situ polymerization within the via.
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申请公布号 |
US7233068(B2) |
申请公布日期 |
2007.06.19 |
申请号 |
US20040943634 |
申请日期 |
2004.09.17 |
申请人 |
INTEL CORPORATION |
发明人 |
RAMACHANDRARAO VIJAYAKUMAR S.;TURKOT, JR. ROBERT B. |
分类号 |
H01L23/48;H01L21/768;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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