发明名称 Filling small dimension vias using supercritical carbon dioxide
摘要 Suitable particles may be deposited within an extremely small high-aspect ratio via by flowing the particles in a suspension using supercritical carbon dioxide. The particles may be made up of diblock copolymers or silesquioxane-based materials or oligomers of phobic homopolymers or pre-formed silica-based particles stabilized using diblock copolymers and may include chemical initiators to permit in situ polymerization within the via.
申请公布号 US7233068(B2) 申请公布日期 2007.06.19
申请号 US20040943634 申请日期 2004.09.17
申请人 INTEL CORPORATION 发明人 RAMACHANDRARAO VIJAYAKUMAR S.;TURKOT, JR. ROBERT B.
分类号 H01L23/48;H01L21/768;H01L23/52;H01L29/40 主分类号 H01L23/48
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