| 摘要 |
A local soldering apparatus of a printed circuit board is provided to reduce a manufacturing cost of the printed circuit board by performing local soldering continuously through one local soldering jig. A local soldering apparatus of a printed circuit board includes a supply unit(20), a gripping unit(30), a soldering material storage tank(22), a local soldering jig(26), and a withdrawing unit. The supply unit(20) supplies the printed circuit board. The gripping unit(30) moves the printed circuit board by gripping the printed circuit board provided through the supply unit(20). The soldering material storage tank(22) has a molten material for local soldering of the printed circuit board. The local soldering jig(26) is installed on an upper part of the soldering material storage tank(22), and has a penetration unit(28) which is formed on a position of the local soldering of the printed circuit board. The withdrawing unit transfers the printed circuit board soldered in the local soldering jig(26) to the next process. The printed circuit board provided through the supply unit(20) is moved to an upper/lower part of the local soldering jig and between the supply unit(20) and the withdrawing unit.
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