发明名称 LEAD-FREE SOLDER ALLOY.
摘要 A lead-free solder alloy includes a tin-copper alloy that also includes a minor amount of cobalt, which has been found to provide a shiny and reflective appearance to the solder alloy. Methods of soldering using such an alloy, as well as a solder joint including such an alloy also are disclosed.
申请公布号 MX2007005622(A) 申请公布日期 2007.06.18
申请号 MX20070005622 申请日期 2005.11.04
申请人 METALLIC RESOURCES, INC. 发明人 STANLEY R. ROTHSCHILD
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