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发明名称
软性印刷电路板构成覆盖膜之制作方法以及覆盖膜结构
摘要
本发明软性印刷电路板构成覆盖膜之制作方法,其主要是利用本发明特殊的覆盖膜结构(由支撑膜、覆盖膜、支撑板所构成),因其支撑板对覆盖膜的支撑性大于支撑膜,使覆盖膜不因其超薄而极度柔软,而能在将覆盖膜覆盖至软性印刷电路板所需进行的对位程序时,相对于知覆盖膜结构(由支撑膜、覆盖膜所构成)有较佳的对位精准度,并且因有支撑板的存在不再需要人工进行对位,而可完全自动化作业。此外,为了进行对位程序,会分别在覆盖膜结构、软性印刷电路板预先形成覆盖对位孔、电路板对位孔。
申请公布号
TW200723984
申请公布日期
2007.06.16
申请号
TW094144265
申请日期
2005.12.14
申请人
科研技术顾问有限公司
发明人
锺金福
分类号
H05K3/28(2006.01)
主分类号
H05K3/28(2006.01)
代理机构
代理人
洪尧顺
主权项
地址
台北市大同区长安西路106号7楼
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