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发明名称
半导体装置及其制造方法
摘要
本发明之半导体装置,系具备:载带基板,系具有柔软之绝缘性膜基材、设置在膜基材上之复数条导体配线、及以覆盖各导体配线上面与二侧面之状态而形成之配线凸块;以及半导体晶片,系装载于载带基板上;半导体晶片之电极透过配线凸块与导体配线连接;在半导体晶片之电极上形成电极凸块,透过配线凸块与电极凸块之接合,使半导体晶片之电极与导体配线连接;电极凸块的硬度较配线凸块的硬度高。藉此可降低当透过半导体晶片之电极与导体配线之凸块进行连接步骤时产生在电极之接合损伤。
申请公布号
TW200723423
申请公布日期
2007.06.16
申请号
TW095113624
申请日期
2006.04.17
申请人
松下电器产业股份有限公司
发明人
松村和彦;下石望
分类号
H01L21/60(2006.01)
主分类号
H01L21/60(2006.01)
代理机构
代理人
桂齐恒;阎启泰
主权项
地址
日本
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