发明名称 MOUNTING STRUCTURE FOR IC CHIP ON PCB
摘要 An IC chip mounting structure for a printed circuit board is provided to prevent damage of an IC chip due to a retainer when a heat sink and the retainer are engaged to each other by using a screw. A heat sink(110) has outer walls formed on both sides, and bosses(140) extending from one side of the outer wall in a center direction. A base(200) is fitted in an inside of the outer wall, and an IC chip(220) is seated on the base. A retainer(300) is seated on the entire surface of the base. The retainer is positioned on an upper portion of the bosses, and the IC chip is positioned on a lower portion of the bosses. The retainer, the base and the heat sink are engaged to each other by a fastening unit penetrating fastened holes.
申请公布号 KR20070062285(A) 申请公布日期 2007.06.15
申请号 KR20050122096 申请日期 2005.12.12
申请人 LG ELECTRONICS INC. 发明人 OH, CHANG HUN;PARK, SANG HO
分类号 H05K7/20;D06F37/00 主分类号 H05K7/20
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