NEGATIVE PHOTORESIST COMPOSITION

摘要

A negative photoresist composition is provided to show excellent thermal resistance as well as good physical properties such as UV transmittivity, remaining rate, pattern stability and chemical resistance, and to be useful in formation of patterns. The negative photoresist composition comprises 3-50 wt% of any one binder resin selected from the group consisting of a resin represented by the formula(1), a resin represented by the formula(2) and a mixture thereof, 2-40 wt% of a multivalent acrylic monomer, 0.01-10 wt% of a photoinitiator and 10-94 wt% of an organic solvent. In the formulae(1) and (2), each R1, R2, R3, R5, R6, R7 and R9 is independently H or methyl group, each R4 and R8 is independently an epoxy group-containing C1-C10 alkyl group or cycloalkyl group, R10 is any one selected from the group consisting of a C1-C14 carboxylic acid, alkoxycarbonyl and aromatic compound, each x, y, l, m and n is a molar ratio of each polymeric unit, wherein the x is 0.02-0.80, y is 0.20-0.98, l is 0.02-0.70, m is 0.05-0.60, and n is 0.01-0.60. Each binder resin is a random copolymer.