| 摘要 |
A method for manufacturing a wiring board is provided to improve reliability of the wiring board by forming a plating layer to cover an upper plane and a side plane of a lead, and a side plane of a conductive pattern. A method for manufacturing a wiring board includes the steps of: preparing a substrate having a base substrate(10), a conductive film which is formed on a surface of the base substrate(10), and a plurality of leads(30) which are formed on the conductive film; forming a resist layer(40) to partially cover a region between two leads adjacent to the conductive film, to be contacted with the two leads; forming a conductive pattern(50) which is electrically connected to a plurality of leads by patterning the conductive film and removing an exposing unit from the resist layer(40) and the plurality of leads of the conductive film; performing a plating process of the plurality of leads by flowing a current on the plurality of leads through the conductive pattern; and electrically insulating the plurality of leads by cutting the conductive pattern. |
