PROCEDE DE FABRICATION D'ASSEMBLAGES MULTICOUCHES DESTINES A RECEVOIR DES BLOCS SEMI-CONDUCTEURS ET ASSEMBLAGES EN

摘要

A process for forming a glass interconnection package for semiconductor chips including the steps of depositing a first layer of glass material on a supporting substrate and then heating the layer in a first gaseous ambient which is soluble in the glass material. Immediately thereafter, the first gaseous ambient is replaced by a second gaseous ambient which is insoluble in the glass material and the glass layer is heated and then cooled down to ambient atmosphere.