发明名称 |
METHOD FOR FABRICATING OF MULTI-LAYER TRANSISTOR USING LASER INDUCED EPITAXIAL GROWTH AND CMP |
摘要 |
A method for fabricating a multi-layer transistor using a laser induced epitaxial growth and CMP is provided to remove efficiently a protrusion from a single crystal silicon layer by performing a CMP process at a low removal speed by using high-flatness slurry. A first active layer(110) is formed on a semiconductor substrate(100). A first transistor(130) is formed on the first active layer. A first insulating layer(140) is formed on the semiconductor substrate. A first epitaxial silicon contact is formed on the first insulating layer. An amorphous silicon layer is formed on the first insulating layer. A single crystal silicon layer(160') is formed by single-crystallizing the amorphous silicon layer. The single crystal silicon layer is planarized by performing a CMP process for removing a protrusion of the single crystal silicon layer. A second active layer is formed by patterning the single crystal silicon layer. A second transistor is formed on the second active layer.
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申请公布号 |
KR20070062149(A) |
申请公布日期 |
2007.06.15 |
申请号 |
KR20050121901 |
申请日期 |
2005.12.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, SUNG JUN;HONG, CHANG KI;YOON, BO UN |
分类号 |
H01L21/336;H01L21/20;H01L21/304 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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