发明名称 METHOD FOR FABRICATING OF MULTI-LAYER TRANSISTOR USING LASER INDUCED EPITAXIAL GROWTH AND CMP
摘要 A method for fabricating a multi-layer transistor using a laser induced epitaxial growth and CMP is provided to remove efficiently a protrusion from a single crystal silicon layer by performing a CMP process at a low removal speed by using high-flatness slurry. A first active layer(110) is formed on a semiconductor substrate(100). A first transistor(130) is formed on the first active layer. A first insulating layer(140) is formed on the semiconductor substrate. A first epitaxial silicon contact is formed on the first insulating layer. An amorphous silicon layer is formed on the first insulating layer. A single crystal silicon layer(160') is formed by single-crystallizing the amorphous silicon layer. The single crystal silicon layer is planarized by performing a CMP process for removing a protrusion of the single crystal silicon layer. A second active layer is formed by patterning the single crystal silicon layer. A second transistor is formed on the second active layer.
申请公布号 KR20070062149(A) 申请公布日期 2007.06.15
申请号 KR20050121901 申请日期 2005.12.12
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, SUNG JUN;HONG, CHANG KI;YOON, BO UN
分类号 H01L21/336;H01L21/20;H01L21/304 主分类号 H01L21/336
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