| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having a semiconductor package structure such as a wafer-level CSP, which has a structure for preventing the extension (advance) of exfoliation at a chip end to realize a package free from fear of severely losing reliability after mounted on a circuit board and its manufacturing method, as well as an electronic apparatus employing the semiconductor device. <P>SOLUTION: The semiconductor device 1 includes, at least, a semiconductor substrate 2 having an electrode 3 placed on one of its surfaces, an insulating resin layer 4 placed to cover one surface of the semiconductor substrate and having an opening to expose the electrode, and a conductive region 6 provided to cover part of the insulating resin layer and electrically connected with the electrode through the opening. A partition 9 extending from one surface of the semiconductor substrate in the thickness direction of the insulating resin layer is provided at least partially between the outer periphery of the semiconductor substrate and the electrode electrically separately from the electrode. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
