发明名称 Plasma processing method, storage medium storing program for implementing the method, and plasma processing apparatus
摘要 A plasma processing method, which enables the etching controllability for a high-dielectric-constant insulating film to be improved. A substrate having a high-dielectric-constant gate insulating film and a hard mask formed thereon is subjected to etching processing using a plasma of a processing gas containing a noble gas and a reducing gas.
申请公布号 US2007134938(A1) 申请公布日期 2007.06.14
申请号 US20050299690 申请日期 2005.12.13
申请人 TOKYO ELECTRON LIMITED 发明人 KOZUKA SHINICHI;UMEHARA NAOTO
分类号 H01L21/31 主分类号 H01L21/31
代理机构 代理人
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