| 摘要 |
There is disclosed is a method comprising surface-processing a Sn based, Sn alloy based or Sn-Zn alloy based solder particle ( 1 ), applied as a coating, such as by electrical plating or melt plating, to the surface of a metal material, such as iron, a steel plate or copper, with a phosphate and a silicium containing compound, to form a protective film ( 2 ). There are also disclosed a solder material ( 6 ) in which a protective film ( 2 ) formed of a phosphate and a silicium containing compound is formed on the surface of the Sn-Zn based solder particle ( 1 ), and a solder paste formed of this solder material ( 6 ) and the flux.
|
