| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic circuit device having a novel printed board capable of simplifying a printed board fixing operation, and improving component mounting density free from problems in resistance to vibration. SOLUTION: The printed board 3 has a through-hole 3a through which a substrate fixing pin 8a protruding from the substrate mounting face 2b of a resin case 2 is passed, and a conductive pattern of the through-hole 3a is soldered with the substrate fixing pin 8a. COPYRIGHT: (C)2007,JPO&INPIT
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