| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate with a built-in coil with high packaging intensity of semiconductor chips and chip components mounted in the upper surface and the lower surface of the substrate, by making high the metalized intensity of the surface wiring conductor of the substrate with a built-in coil. SOLUTION: The method for manufacturing a wiring board includes a step of preparing a ferrite green sheet 11, a step of printing on the surface of the ferrite green sheet 11 a metal conductor paste 13 to which bivalent metal oxide is added, a step of fabricating a laminate 12 at which the ferrite green sheet on which the metal conductor paste 13 is printed is located in the surface layer, and a step of calcinating the laminate 12. COPYRIGHT: (C)2007,JPO&INPIT |
