发明名称 THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition having high thermal conductivity and scarcely deteriorating a resin during molding and to provide a molded product excellent in high thermal conductivity by the resin composition. SOLUTION: The thermoplastic resin composition (1) comprises (A) a thermoplastic resin, (B) a composite filler having a core-shell structure composed of a shell containing a conductive substance selected from the group I consisting of Au, Pt, Ag, Ni, Sn, Ti and Ta and a core composed of metal particles containing a metal selected from the group II consisting of Mg, Al, Fe, Cu, Zn, Mo and W. The molded product (2) is obtained by molding the liquid crystalline polyester resin composition (1). COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007146068(A) 申请公布日期 2007.06.14
申请号 JP20050345219 申请日期 2005.11.30
申请人 SUMITOMO CHEMICAL CO LTD 发明人 KOMATSU SHINTARO;MAEDA MITSUO
分类号 C08L67/00;C08K3/04;C08K7/06 主分类号 C08L67/00
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