发明名称 |
Electroless plating apparatus and electroless plating method |
摘要 |
An electroless plating apparatus performs electroless plating on a wiring portion with a plating solution using a reducer having low reduction power. The electroless plating apparatus includes a support member with a conductive portion, which supports a substrate; a plating-solution feeding mechanism which feeds the plating solution to a top surface of the substrate supported by the support member; a metal member which is provided at the support member in such a way as to be contactable to the plating solution and dissolves into the plating solution when in contact therewith to thereby generate electrons; and an electron supply passage which supplies the electrons generated by the dissolved metal member to the wiring portion on the substrate via the conductive portion of the support member.
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申请公布号 |
US2007134431(A1) |
申请公布日期 |
2007.06.14 |
申请号 |
US20060606930 |
申请日期 |
2006.12.01 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
HARA KENICHI;TOSHIMA TAKAYUKI;IWASHITA MITSUAKI;ORII TAKEHIKO |
分类号 |
B05D5/12;B05C5/00;B05D1/18 |
主分类号 |
B05D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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