发明名称 Process for producing schottky junction type semiconductor device
摘要 A process for producing a Schottky junction type semiconductor device includes the steps of forming a Schottky electrode on a surface of a silicon carbide epitaxial layer, wherein a Schottky electrode made of molybdenum, tungsten, or an alloy thereof is formed on the surface of the silicon carbide epitaxial layer and is subjected to heat treatment so as to induce an alloying reaction at an interface of the silicon carbide epitaxial layer and the Schottky electrode, thereby forming an alloy layer at the interface, whereby the height of a Schottky barrier is controlled while maintaining an n-factor at a nearly constant low value.
申请公布号 US2007134897(A1) 申请公布日期 2007.06.14
申请号 US20050594044 申请日期 2005.03.25
申请人 CENTRAL RESEARCH INSTITITE OF ELECTRIC POWER INDUSTRY 发明人 NAKAMURA TOMONORI;TSUCHIDA HIDEKAZU;MIYANAGI TOSHIYUKI
分类号 H01L21/28;H01L29/24;H01L29/47;H01L29/872 主分类号 H01L21/28
代理机构 代理人
主权项
地址