METHOD AND SYSTEM FOR DOUBLE-SIDED PATTERNING OF SUBSTRATES

摘要

The present invention is directed towards a method and a system of patterning first and second opposed sides of a substrate. The method and system may employ a mold assembly and obtaining a desired spatial relationship between the first and second opposed sides of the substrate and the mold assembly. In a further embodiment, the method and system may employ a first and a second mold assembly.