发明名称 PACKAGE FOR LIGHT TRANSMITTING/RECEIVING MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a package for a light transmitting/receiving module which can increase a degree of signal accumulation much more even if used in the same sized package. <P>SOLUTION: The package for a light transmitting/receiving module, concerning one embodiment, includes a stem having a through hole, a metal mount positioned on an upper surface of the stem, signal lines mounted to the metal mount, and a plurality of lead lines which protrudes from the lower surface of the stem and are electrically connected to photo-elements fixed on the metal mount through the through hole. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007150241(A) 申请公布日期 2007.06.14
申请号 JP20060180183 申请日期 2006.06.29
申请人 KOREA ELECTRONICS TELECOMMUN 发明人 KIM SUNG IL;MOON JONG TAE
分类号 H01S5/022;H01L31/02 主分类号 H01S5/022
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