| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve heat radiation of a semiconductor device which has a tape or film substrate. <P>SOLUTION: A TCP 1 has the tape substrate 5 including a conductive copper wiring line 5d formed on a base material 5c, a solder resist film 5e formed on the copper wiring line 5d, and copper foil 3 formed on the solder resist film 5e; and a semiconductor chip 2 electrically connected onto the copper wiring line 5d through an Au bump 6. The solder resist film 5e is thicker than the base material 5c, so heat emitted by the semiconductor chip 2 can be conducted to the metal foil 3 through the copper wiring line 5d and solder resist film 5e and radiated to the outside from the metal foil 3. Consequently, the heat radiation of the TCP (semiconductor device) 1 can be improved. <P>COPYRIGHT: (C)2007,JPO&INPIT |
