| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To easily reduce a space by excellently and surely peeling a support layer from a resin layer with a simple process and constitution. <P>SOLUTION: This peeling device 122 has a base holding mechanism 124, a substrate holding mechanism 126 and a moving mechanism 128. While the base holding mechanism 124 has a suction box 130 maintaining and holding a surface state when sticking a base film 26 to a glass substrate 24, the substrate holding mechanism 126 has an adsorption box 132 sucking and holding the glass substrate 24. The moving mechanism 128 is connected to the substrate holding mechanism 126, and performs operation for peeling the glass substrate 24 sucked and held by the adsorption box 132 from the base film 26 sucked and held by the adsorption box 132 by maintaining the surface state. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
