发明名称 MICROPHONE PACKAGE
摘要 PROBLEM TO BE SOLVED: To provide a microphone package which is provided with a leak hole with stable dimensional accuracy, and thereby provides acoustic characteristics excellently at a low cost. SOLUTION: The microphone package includes: a circuit board 2; a microphone chip 3 mounted on the circuit board 2; and a case 7 enclosing the microphone chip 3 in a way of forming a space around the upper part of the microphone chip 3 and sealed to and mounted on the circuit board 2. The case 7 comprises two large and small cases 5, 6 of nearly the same shape, fitted to each other and used twofold, the cases 5, 6 respectively have through-holes 8, 9, and a groove 10 is formed to the joining face of the two cases 5, 6 so as to form a vent hole by communicatively connecting the two through-holes 8, 9 in a state in which the two cases 5, 6 are fitted to each other. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007150514(A) 申请公布日期 2007.06.14
申请号 JP20050339974 申请日期 2005.11.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 TAKAHATA TOSHIHIKO;KAWADA HIROSHI;YOSHIDA TAKESHI;USHIYAMA NAOKI
分类号 H04R19/04;H04R1/02 主分类号 H04R19/04
代理机构 代理人
主权项
地址